Shin-Etsu MicroSi CPU Silicone Thermal Compound Grease / Paste 0.5g Syringe Gray Tube with Isopropyl Alcohol Wipe X23-7783D. Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. It is designed for a wide range of applications between modern high-power CPUs and GPUs and high-performance heatsinks or water-cooling solutions. Shin-Etsu MicroSi’s X23-7783D thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23-7783D to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X23-7783D is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.

Shin-Etsu MicroSi Part Number: X23-7783D

Specifications:

Color/Appearance: Gray
Viscosity: 200 Pascals/second
Bleed (423°K/24hr): 0
Thermal Conductivity: 6.0 (W/m K)
Specific Gravity: 2.6
Volatile Content: 2.43%
Storage Conditions: 60F to 85F (15C - 29C)